​

Actual position

Period: from September 2022 to nowdays

Position: Responsible for R&D 1337 Lab

Company, location: SIAE MICROELETTRONICA – Cologno Monzese (MI), Italy

Specific task:

• Developing innovative planar and non-planar passive devices up to D-band;

• Developing high-power RF line-ups for O-RAN applications;

• Responsible for European fundend projects and activities.

​

Previous working experience

Period: from May 1st, 2017 to August 2022

Position: Microwave and mm-wave passive designer

Company, location: SIAE MICROELETTRONICA – Cologno Monzese (MI), Italy

Specific task:

• Design of waveguide and planar passive components for E-band (71-86 GHz) frequency band;

• Exploiting additive 3D printing manufacturing technique for microwave and mm-wave application;

• Feasibility study on new topologies for a high gain E-band steerable antenna for point-to-point communication.

​

Period: from November 1st, 2015 to April 30th, 2017.

Position: Hardware and RF engineer

Company, location: Azcom Technology – Rozzano, Italy

Specific task:

• Design of RF transmission and receiver chains for small cells and base station oriented towards the LTE standards;

• Testing and validation of RF transceivers and analog front end boards for 3GPP standards.

Background skills

• Design, realization and testing of microwave and mm-wave passive devices adopting both waveguide and planar technologies;

• EM characterization of standard and non-standard materials;

• Microwave passive devices based on the 3D printing technology;

• Development of a manufacturing technique for paper-based RF and microwave components;

• Preliminary design of mm-wave ultra-wideband imaging radar for breast cancer detection;

• Design and testing of graphene-based microwave attenuators in cooperation with the Italian INFN.