2024-on going

EMISPHERE "Enabling Microelectronics Solutions for Next-Generation High-Performance 6G Networks"

IPCEI ME/CT - Microelectronics and Communication Technology – the Italian IPCEI Microelettronica 2 program.

https://competition-policy.ec.europa.eu/state-aid/ipcei_en

Brief summary:

SIAE MICROELETTRONICA is one of the four Italian companies selected as recipients of the IPCEI funds, being able to receive state aid to sustain the multi-years program aimed to develop a new generation of radio products for the mobile communications industry.The company is improving the European value chain with in-house development of innovative modem chips, microwave components and the antennas to enable the next generation microwave radio links to reach 100 Gbit/s transport capacity in the W and D band.

SIAE MICROELETTRONICA is also developing ready-to-market products in the Radio Access portion of the network. The new O-RAN standards open the market to new players and SIAE MICROELETTRONICA leverages its decades of experience in microwave development to introduce new state-of-the-art Open Radio Unit products.

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2022-on going

SHIFT "Sustainable Technologies Enabling Future Telecom Applications"

SHIFT is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities, under grant agreement n° 101096256.

https://www.shiftkdt.eu/

Brief summary:

SHIFT develops innovative semiconductor and packaging technologies for telecommunication areas such as 5GNR (Beyond 5G) and 6G wireless network access and backhaul, ultra-high speed optical links between servers, satellite telecommunications, and Earth observation.

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2020-2024

VISTAM "V band Inter Satellite link solid sTate power Amplifier Module"

https://connectivity.esa.int/projects/vistam

Brief summary:

The main objective of this activity is to enable inter-satellite communication link at 5000 km distance and with up to 10 Gbit/s capacity. In order to achieve the required data rate and link length, the main technical objective is to increase both the bandwidth and the transmitted power. In the first case, a greater bandwidth availability allows the use of wider frequency channels. In the second case, the idea is to allow the use of higher-order modulations, increasing the number of bits per symbol. The overall result derived from the combination of these two approaches allows to reach the target requirements. This PA is able to provide 10 W of output power measured at P1dB over the whole 59-71 GHz frequency band ensuring enough power and linearity to enable communication link up to 5000 km with enough linearity to work with highly complex modulated signals.

 

2018-2022

STEDI "Small user TErminal multiband DIplexers"

ESA project for the development and space assessment of novel user terminal Ku/Ka band diplexers for space communications, ground segment (ESA/ESTEC Contract AO/1-8928/17/NL/CLP/gm).

https://rfmicrotech.com/stedi/

Brief summary:

Goal of the project was the development, test and comparison of different technology concepts for user terminal Ku-/Ka-band diplexers using novel technologies, aiming at large-scale low-cost fabrication of RF compact filters compatible with planar and monolithic circuits. The compared technologies are Micromachining on silicon, LTCC (Low Temperature Co-fired Ceramic) and thin-film alumina. RF Microtech (Perugia, Italy) is the prime contractor, responsible for the electro-magnetic design and test of Micromachining and LTCC designs. SIAE MICROELETTRONICA (Cologno Monzese, Italy) is involved in the electro-mechanical design and validation of SIW design.

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​2013-2016

GRETA "GREen TAgs"

Italian National Project PRIN

http://www.greentags.eu/​

Brief summary:

The development of electronic circuits on biodegradable substrates (specifically paper-based), capable of harvesting energy from the environment and using it to perform sensing functions (such as detecting and transmitting various types of data) and localization: this is, in summary, the Greta project (GREen TAgs and sensors with ultrawideband identification and localization capabilities).